Copper oxide agent
Ideal for electroplating and electroless plating.
Copper oxide for plating (SS-CuO) is a powdered product used for replenishing copper ions in various copper plating solutions, making it ideal not only for electroplating but also for electroless plating. It is easy to work with and allows for very convenient management of the plating process. There is no increase in FREE Acid, enabling the maintenance of a stable plating bath. 【Features】 ■ High-purity functional copper oxide fine powder ■ Low residual chlorine content and excellent acid solubility ■ Achieves optimal effects for electro copper plating ■ Excellent powder flowability with an angle of repose below 35º For more details, please refer to the catalog or feel free to contact us.
- Company:ラットコーポレーション 本社:営業部・業務部
- Price:Other